This is an abbreviated list of products we make…but we are capable of doing much more!
HEATSINKS: |
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| Manufacturing Method/Types: | Extruded, Stamped, Skived, Machined, Cast, Cross-Cut, Heat-Pipe assemblies, Pin-Fin, Fan Heatsinks, Remote Heat Exchangers, Bonded Fin, Folded Fin; Liquid Cooling, Active Cooling, Passive Cooling, Conduction Cooling |
| Materials: | Aluminum, Copper, CTE Matched Materials |
| Typical Applications: |
Voltage Regulators, High Power Semiconductors, Lasers, LED, BGA’s, DC-DC Converters,
Microprocessors, Graphic Processors, RF amplifiers, Rectifiers, Enterprise Computer Systems, Medical Telecom, Transportation, Microwave Housings, IGBT Modules, Electrolytic Capacitors, TO-220, TO-3, TO-247, TO-5, Surface Mount Devices |
ALUMINUM EXTRUSIONS: |
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| Capabilities: |
Extruded from ¼” to 22” Wide, Aspect Ratios up to 22:1; Thin Walls (0.018”);
Proto-type runs as low as 100lbs Heatsink and Non-Heatsink Shapes Solid, Semi-Hollow and Hollow Dies. |
THERMAL INTERFACE MATERIALS: |
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| Capabilities: | Gap Fillers, Phase Change, Thermally Conductive Greases, Electrically Insulating, thermally conductive materials (Elastomeric, BeO and Double Sided Tape, Putty, Ultra Conforming Materials. |
MACHINED PLASTICS: |
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| Typical Products: | Insulators, Chip Nests & Sockets; Electrical Connectors & Insulators; Frames, Test Fixtures, Chip Carriers, Instrument Panels; Screens, Shields, Shims, Shrouds, Spacers & Stiffeners. |
| Manufacturing Capabilities: | Precision Machining: Tolerances to ±0.0003” (0.006mm) Hole Diameters: 0.003” (0.076mm) |
| Typical Materials: | Torlon, PEEK, Polyamide, FR-4/G-10/GPO and other Glass Filled Laminates (including PEEK), Vespel, Ultem, Nylon, Acetals, Acrylic, Phenolic |
METAL STAMPINGS: |
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| Typical Products: |
EMI &RMI Shielding, Spring Clips, Handles, Brackets, Lead-Frames, Terminals (Lugs), Buss Bar Mounts, Spacers, PCI Brackets, Wire Forms, Drawn Parts, Heatsinks, Face Plates |
HARDWARE: |
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| Typical Products (Custom): |
Guide pins, springs, Screws, Bolts, Nuts, Washers, Shims, Anchors, Retainers, Flanges, Manifolds, Knobs, Handles, Bumpers, Grommets, U-Bolts, Eybolts, Channels, bushings, PCB Standoffs, Sleeve Bearings, shafts, |
ENCLOSURES: |
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For a number of our customers, we will purchase NEMA boxes from the standard products line of existing customers and modify them in-house per our customers drawings. This is often a very cost effective way to obtain customized boxes for electrical / electronic applications. |
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| Modified Outsource: | You pick the enclosure available from a existing supplier of enclosures and we will modify to your requirements. We will machine holes, make and apply any special mounting brackets, custom paint and silk screen the enclosures |
| Specialty Enclosures: |
Cold Walls, ATR Boxes, LRU Enclosures, ARINC
Enclosures |
CTE MATCHED MATERIALS: |
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| Typical Products (Standard): | In some high powered Integrated Circuit (IC) designs there is a need for passive cooling via high performance conductive heats sinks that are CTE (Coefficient of Thermal Expansion) matched to the IC material. There are limitations of thermal conductivity or geometry possibilities for conventional materials. By using a correctly selected and assembled laminar heat sink structure, increased passive cooling via thermal conduction can be achieved. |
| All Axis Machining Expertise is in machining these CTE matched materials. If your design requires, we can procure a tailorable CTE material where Semiconductor chips can be direct die attached to the substrate. Typical material we work with are Copper Graphite, Aluminum Graphite, Aluminum Silicon Carbide (AlSIC). | |